Wire bonder equipment is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the time of chip packaging. The thin-wire is used to make these connections that are generally made of gold, copper, aluminum or silver. The global wire bonder equipment market is anticipated to predict a promising growth rate during the forecast period from 2017 to 2025 owing to the constant introduction of new electronics like smartphone with improved features that compels the vendors to modify the manufacturing process with the existing and new standards. Thus it is expected to increase the demand of wire bond equipment during the forecast period.
The global wire bonder equipment market is expected to witness a highest growth rate in the coming years due to the emergence of new types of chip packaging. This new type of chip packaging is likely to offer Integrated Device Manufacturers (IDMs) and Outsourced Semiconductor Assembly and Testing (OSATs) with new business opportunities in the coming years. This has led to the increase in growth of the semiconductor packaging equipment like wire bonder equipment and is expected to witness a promising growth during the forecast period.
With the advent of new packaging technologies like MEMs packaging, TSV packaging has changed the manufacturing landscape of the semiconductor industry. Thus, the equipment manufacturers have to undertake significant investment to ensure that their devices are up-to-date and of latest technologies.
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However, the increase complexity of the production process, consumption of additional time and also the increasing probability of defects is predicted to restrain its growth rate of wire bonder equipment to some extent during the forecast period. In spite of this challenges, increasing use of 3D chip packaging have accelerated the growth of this market.
For the purpose of providing detailed research report, the global wire bonder equipment market is segmented on the basis of product type and end user. On the basis of product type the market is segmented into wedge bonders, stud-bump bonders and ball bonders. Among the various product types of wire bonder equipment available in the market, the ball bonder is expected to experience a rapid growth rate owing to its fast speed as compared to the other product types. The ball bonder is suited for fine pitch applications of 40 micron or less.
Some of the key vendors operating in the global Wire bonder equipment market includes ASM Pacific Technology (Netherlands), Kulicke & Sofa (Singapore), Palomar Technologies (California), F&K Delvotec Bondetechnik (Singapore) among others.