Wire bonder equipment is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the time of chip packaging. The thin-wire is used to make these connections that are generally made of gold, copper, aluminum or silver.
The global wire bonder equipment market is anticipated to predict a promising growth rate during the forecast period from 2017 to 2025 owing to the constant introduction of new electronics like smartphone with improved features that compels the vendors to modify the manufacturing process with the existing and new standards. Thus it is expected to increase the demand of wire bond equipment during the forecast period.
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Wire bonder equipment also finds its application across various end user segments including Integrated Device Manufacturers (IDMs) and Outsourced Semiconductor Assembly and Testing (OSATs). Among various end user segment, OSATs is expected to witness the growth rate at a highest CAGR during the forecast period owing to the fact that rapid increase in number of OSATs vendors that uses wire bonder equipment for advance chip manufacturing.
In addition, increase production capacity and constant technological innovations in packaging technique is one of the driving factor of wire bonder equipment market. However, the rising research and development activities and the adoption of innovative technologies by semiconductor packaging industry is also expected to fuel the market growth.